Product Mix and Types

• Single-Sided board
• Double-sided board
• Multilayer board (4 to 24 layers)
• Solder Mask Over Bare Copper Process
• Lead-free HASL Process
• Solder Mask over Tin & Lead Fuse Process
• Peelable Mask Process
• Selective Gold Processper process
• Carbon Contact Processss gold process
• Liquid Photo-imageable Solder Mask Processfuse process
• CEM1, CEM3, FR-4, Tg 130°, FR4 Tg 175°, Polyimide 278°