Annual Usage: Pcs.       Monthly Usage:: Pcs.

LAYERS: Single Double 4 Layers 6 Layers 8 Layers Layers

MATERIAL: Phenol CEM-1 CEM-3 FR-4 materials

INNER LAYER: 

BOARD SIZE:  X

ARRAYED PANEL SIZE:  UP, X , Fiducial points with V-groove cut and breakaway drill holes.

PROCESS:
  Drill/single sided
  Drill/plated through holes
  Piercing & punching/Single sided
  SMD Pattern
  Solder mask thermal type LPI
   Solder mask color: 
   Legend color: 
  Solder Mask over bare copper Hot air solder leveling
  Selective Gold
  Immersion Gold
  Routing V-Groove cut

DELIVERY TERMS:

NOTES: